ODM business history

2019

Started production of LED modules for automotive rear lighting
*Introduced automatic inspection technology for shape and surface abnormalities

2018

Expansion of Peltier overseas factory (YEB)

2016

Started Peltier assembly for optical communication

2015

Started production of LED lens molding modules for commercial printers
*Introduced potting lens molding technology

2008

Started production of LED-COB for lighting, developed overseas assembly factory (YEB)
*Introduced low thermal resistance substrate assembly technology and resin coating technology

2005

Started assembly of MEMS for automotive use
* Introduced hermetic assembly technology and in-vehicle quality system

1997

Launched an overseas assembly plant (YEB)

1993

Memory SMT implementation started (for PC expansion memory)

1990

Introduced COB assembly (for games, watches, thermometers, etc.)
Introduced Q*IC/parts mixed technology

1985

DIP16 (DRAM-64K) assembly started
QFP, QFN, BGA Sequential development
*Introduction of general semiconductor assembly technology