Yoshikawakogyo RF Semicon Co., Ltd. has been corresponding to expectation of semiconductor industry with rich line-up of equipments which aligned with customer needs in all processes from wafer test to final test and back-end!
| Use | Equipment Manufacturer | Model Name | Main Specification |
|---|---|---|---|
| Logic Tester | ADVANTEST | T3347A | Frequency=40MHz、I/O=256pin、2ST、STE=1MW、SBM=256MB、ALPG、ADC、IDDQ Options available |
| T6575 | Frequency=125MHz、I/O=512pin ADDA、IDDQ、SCAN、ALPG | ||
| T6577 | Frequency=125MHz、I/O=1024pin VAFG/D、BBWG/D、SCAN、ALPG | ||
| T2000 | Frequency=500MHz、I/O=1024pin、LCDPS、DPS500ｍA、PMU32、RC5V192 | ||
| Yokogawa Electric | TS6000 | Frequency=20MHz、I/O=512pin SCAN、ALPG | |
| TS600 | Frequency=20MHz、I/O=512pin SCAN、ALPG | ||
| TS6000H(AL9740) | Frequency=125MHz、I/O=512pin or 768pin SCAN、ALPG、DPSTH=8ch | ||
| Ando Electric | AL9737 | Frequency=100MHz、I/O=512pin ALPG、SPU |
| Use | Equipment Manufacturer | Model Name | Main Specification |
|---|---|---|---|
| Memory Tester | ADVANTEST | T5377 | Frequency=143MHz/286MHz、PPS256/ST、DRV2048pin/ST、I/O1280pin/ST、LevelDRV256pin/ST、256 Simul-Test/ST、FM128Gb |
| Use | Equipment Manufacturer | Model Name | Main Specification |
|---|---|---|---|
| Analog tester (Mixed signal) | Yokogawa Electric | TS1000 | Frequency=5MHz、I/O=96pin(Transit BOX：48pin) TIM、HRG/D、UVI、WFG/D |
| ADVANTEST | V93000 | TH-Class:C 100/50MHz I/O=768pin DC=64ch Wave Scale MX | |
| HEWLETT PACKARD | HP94000/9494/ 9492B/9493B |
Frequency=32MHz、I/O=64/128pin AWG/DIGITIZER | |
| Shibasoku | WL25 | Perpin DC : 512pin , Frequency=5MHz , 16 Simul-Test , HighPower V/I : ±60V,±10A | |
| Teradyne | Catalyst | Video Options : 4sets | |
| Others | YTEC | S100 |
Frequency=100MHZ、 I/O=512pin(MAX) 4SLOT Type 128 Simul-Test)
|
| ADVANTEST | EVA100 |
Frequency=100MHz、IO=64pin Module consists:GCMx16ch + AVIx24ch + SCAPx8ch + DMx64ch + LFx8ch + HFx4ch |
| Use | Equipment Manufacturer | Model Name | Main Specification |
|---|---|---|---|
| Prober | Tokyo Seimitsu | UF190A/UF190B | Wafer size Φ5”,Φ6”,Φ8” 50℃～150℃ ＊ For ink mark exclusive |
| UF200 | Wafer size Φ5”,Φ6”,Φ8” 50℃～150℃ Cleaning Unit Φ5 | ||
| UF200A | Wafer size Φ5”,Φ6”,Φ8” 50℃～150℃ Cleaning UnitΦ5 | ||
| FP200A |
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| UF3000 | Wafer size Φ8”,Φ12” 50℃～150℃ or -40℃～150℃ Cleaning Unit 150×150 Cleaning Brush | ||
| UF3000EX-e | Wafer size Φ8”,Φ12” -55℃ ～ 200℃ or -40℃～150℃ Cleaning Unit 150×150 Cleaning Brush | ||
| UF2000 | Wafer size Φ5”,Φ6”,Φ8” -55℃～200℃ Cleaning Unit 150×150 Cleaning Brush | ||
| AP3000 | Wafer size Φ8", Φ12" -55°C to 200°C Cleaning unit 110×160 Cleaning brush | ||
| Tokyo Electron | P-12XLn/P-12XLn+ |
Wafer size Φ8”,Φ12” 25℃～150℃ or -40℃～150℃ Cleaning Unit 230×155 Cleaning Brush |
| Use | Equipment Manufacturer/th> | Model Name | Main Specification |
|---|---|---|---|
| Handler | Epson | NS-8080 |
QFP/SOP/TSOP/PGA/BGA/PLCC/PGA/QFN:□3～□50(Lead pitch 0.40mm～) Socket pitch:8piece test(40x60) 1,2,3,4 piece test:(80x60),(60x80),(60x60),(80x80) without room temperature control High temperature control(50℃～130℃±3℃) Through put(8300UPH/ at time of 8 piece test, best effort) |
| NS-8080W |
QFP/SOP/TSOP/PGA/BGA/PLCC/PGA/QFN:□3～□50(Lead pitch 0.40mm～) Socket pitch:8piece test(40x60 / 60x60) 1,2,3,4 piece test：(80x60),(60x80),(60x60),(80x80) without room temperature control High temperature control(50℃～130℃±3℃) Through put(8200UPH/ at time of 8 piece test, best effort) |
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| Tesec | HS2000 |
QFP/SOP/TSOP:□7～□32(at time of 4DUT □7～□20) BGA/QFN:□4～□20 Socket pitch:(80mm/2DUTinline) or(40mm/４DUTinline) without room temperature control High temperature control:50℃～100℃±3℃,100℃～125℃±5℃ |
|
| 9250-IH |
SOP(4.4mm Width) Socket pitch:4 piece test(Shoot pitch:50mm /Station pitch :80mm) Plastic subject High temperature setting(50℃～130℃±3℃) |
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| APIC YAMADA CORPORATION | A206x4 |
BGA/QFP/PLCC/LCC/SOP/SOJ/QFN:□3～□40(Thickness 0.8mm～5mm/Lead pitch 0.4mm～) Socket pitch:1,2,4Piece test(broad:55mm or 60mm or 73.66mm or 80mm)(long:40mm or 60mm) High temp test(50℃～125℃±3℃) |
|
| A206sp |
BGA/QFP/PLCC/LCC/SOP/SOJ/QFN:□3～□40(Thickness 0.8mm～5mm/Lead pitch 0.4mm～) Socket pitch:2 piece test(55mm or 60mm or 73.66mm or 80mm) High temp test(50℃～125℃±3℃) |
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| SYNAX | SX2400 |
BAG/CSP/TSOP/QFP:□7～□40(Thickness 0.6mm～5mm/Lead pitch 0.4mm～/Ball pitch 0.5mm～) 1,2,4,8 piece test Low temp mode (0℃～-55℃±3℃)High temp mode(50℃～150℃±3℃) |
|
| SX1104H |
BGA/CSP/TSOP/QFP:□3～□38(Thickness 0.6mm～5mm/Lead pitch 0.4mm～) Socket pitch: 2,4 piece test (broad:60mm)(long:60mm or 80mm) |
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| SX1255H |
QFP,V,S/TQFP/PLCC/SOJ/TSOP/BAG:□7～□40(Lead pitch 0.5mm～) 2 piece test (long:50mm) high temp mode (50℃～125℃±3℃) |
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| S9 |
BGA/CSP/TSOP/QFP/QFN:□3～□50(Thickness 0.6mm～5mm/Lead pitch 0.4mm～/Ball pitch 0.5mm～) *There are limitation due to contact layout, etc. 1,2,4,8 piece test high temp mode (50.0℃～90.0℃±2℃/90.1℃～130.0℃±3℃/130.1℃～150.0℃±5℃) |
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| S9PulsCC |
BGA/CSP/TSOP/QFP/QFN:□3～□50(Thickness 0.6mm～5mm/Lead pitch 0.4mm～/Ball pitch 0.5mm～) *There are limitation due to contact layout, etc. 1,2,4,8,16 piece test high temp mode (50.0℃～90.0℃±2℃/90.1℃～130.0℃±3℃/130.1℃～150.0℃±5℃) Low temp mode(-40℃±2℃) |
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| ADVANTEST | M4541A |
QFP/BGA/CSP:□5～□50(Thickness 1.0mm～4.5mm) at time of 1 piece test:□5～□50 at time of 2 piece test(2×1)：□5～□50 at time of 4 piece test(2×2)：□5～□35 at time of 4 piece test(4×1)：□5～□20 high temp mode (50.0℃～90.0℃±2℃/90.1℃～125.0℃±3℃) |
|
| M4741A |
QFP/BGA/CSP: □5 to □50 (Thickness 1.0mm to 4.5mm) Measurement for 2 components (2×1): □5 to □50 Measurement for 4 components (2×2): □5 to □35 High-temperature mode (50.0°C to 90.0°C ±2°C / 90.1°C to 125.0°C ±3°C) |
| Use | Equipment Manufacturer | Model Name | Main Specification |
|---|---|---|---|
| Dust free Temperature (& Humidity) (Bake furnace) chamber | Espec | PVHC-231M PVHC-231 |
(Ambient temp + 60)℃～+350℃ |
| PVC-230 PVC-231 |
(Ambient temp+ 60)℃～+ 200℃ | ||
| Temperature (& Humidity) chamber (Bake furnace) | Espec | ST-120 | (Ambient temp + 20)℃～+ 200℃ |
| PH-300 | (Ambient temp + 20)℃～+ 200℃ | ||
| Trimmer | GSIJ | M435 | wafer sizeΦ12” Laser wavelength 1065nm Spot size 1.5～2.7um Max field size 36×36mm Max Oscillation frequency 50kHz |
| High-speed needle trace inspection device | Tokyo Electron | TELPADS | Wafer size Φ8”,Φ12” |
| Visual Inspection Equipment | Olympus | AL3100 | Wafer size Φ12” |
| Visual Inspection Equipment | Olympus | AL110-LMB86 | Wafer size Φ６”,Φ８” |
| Wafer cleaner | Harmotech | HWC-0812-11 | Wafer size Φ8”,Φ12” |
| Scanner | ICOS | CI-T120 | QFP/BGA/QFN□3～□27 Foreign substance inspection capable Through put 20000UPH(besteffort) |
| Yasunaga | LI-920 |
QFP、SOP ：3×3～30×30mm BGA、LGA､QFN：3×3～30×30mm |
|
| Burn-in | Fujita | FBS-1000 | Vector memory 4Kw Frequency 5MHz ALPG,FPGA |
| IC automatic insertion/extraction machine | Fujita | BZ-5000TSW | QFP product Burn in board ⇔ JECEC Tray IC sorting |
| Fujita | TR-8000CHT-CS | QFP product Burn in board ⇔ JECEC Tray IC sorting | |
| Visual Inspection taping equipment | PALMEC | W110 |
QFP/SOP/QFN/BGA:□4～□16 Capable to inspect back side lead scratch and foreign substance Tray to Tray or Tray to Tape |
| Fujita | TTI-1200W |
SOP Tray to Tape(Embossed carrier tape width 12mm～16mm / Cover tape width 9.5mm～13.5mm) |
|
| Nagata Seiki | NK8300 |
WLCSP(8 inch) Wafer to Tape(Embossed carrier tape width 8mm～12mm) Tray to Tape(Embossed carrier tape width 8mm～12mm) |
|
| NK9100 |
QFP/SOP Tray to Tray or Tray to Tape (Embossed carrier tape width 8mm～16mm) |
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| Ueno Seiki | NLT20 |
SOP Tray to Tape |
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| Tape to Tray Sorter | PALMEC | RT-3000 | Sorting from tape to tray (Un-taping capable) |
| Probe card checker | RUDOLPH | PRVX3 | TS6000H(AL9740) 768 pin card applicable |
| Use | Equipment Manufacturer | Model Name | Main Specification |
|---|---|---|---|
| Back grind equipment | Okamoto Machine Tool Manufacturing Co. | GNX200B | 6/8 inch wafer applicable |
| Tape applicator machine | Takatori Corporation | ATM-1100G | 6/8 inch wafer applicable |
| Tape peeling machine | Takatori Corporation | ATRM-2300 | 6/8 inch wafer applicable |